Curtin Malaysia inks enhanced collaboration deal with IEM

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Representatives from both parties attending the MoU signing.

MIRI: Curtin University Malaysia (Curtin Malaysia) signed a memorandum of understanding (MoU) for renewed and enhanced collaboration with Institution of Engineers Malaysia (IEM) recently.

The signing took place during the biennial dinner of Miri IEM here.

Signing on behalf of the university were pro vice-chancellor, president and chief executive Professor Simon Leunig and dean of Faculty of Engineering and Science Professor Tuong-Thuy Vu, while IEM Malaysia president Ir Professor Norlida Buniyamin and Miri IEM chairperson Ir Chong Boon Hui signed for IEM.

In his speech delivered by Miri City Council councillor Jeffrey Phang, Minister for Transport, Datuk Seri Lee Kim Shin commended Miri IEM for its collaborations with higher education institutions like Curtin Malaysia and with industry players in Sarawak.

“This has contributed greatly to the development of science and technology in Miri and Sarawak in general.”

He added that the collaboration with academia and industry benefitted both sectors in conducting research for improved technologies and also in meeting the human capital needs of industry.

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Curtin Malaysia on its part would assist IEM to recruit student members from new intakes of its engineering programmes and encourage engineering academics and undergraduates to become members of IEM.

A significant number of Curtin Malaysia’s engineering students are actively involved in IEM activities through membership in the IEM Young Engineers Section (YES) and Curtin Malaysia IEM Student Chapter and this would also be enhanced under the MoU.

Curtin Malaysia and IEM would also collaborate in joint research and consultancy activities, joint organisation of seminars and academic meetings, and the exchange of academic materials and other information to expand the body of knowledge in both organisations.

Representatives from both parties attending the MoU signing.
Representatives from both parties attending the MoU signing.

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